Components code and abbreviation in Laptop motherboard
COMPONENTS CODE
KODE HURUP KOMPONEN
C :CAPASITOR
D :DIODA
F :FUSE
L :INDUKTOR
PC :POWER CAPASITOR
PD :POWER DIODES/DIODA
PL :POWER INDUCTOR
PQ :POWER TRANSISTOR
PR :POWER RESISTOR
PU :POWER INTEGRATED CIRCUIT
Q :TRANSISTOR
R :RESISTOR
T : Transformers
U :INTEGRATED CIRCUIT/BGA CHIP/EMBEDDED CONTROLER/BIOS IC,ETC
X : Terminal strips, terminations, joins .oscilator
Y : Crystal
ABBREVIATION ON LAPTOP MOTHERBOARD DAN SCHEMATIC
AC : Alternating current
ACDRV : AC adapter to system-switch driver output
ACEDET : Adaptor Current Detector
ACGOOD : Valid adapter active-low detect logic open-drain output
ACIN : Adaptor Current sensor
Input
ACN : Adapter current sense
resistor
ACOP : Input Over-Power Protection
ACOV : Input Overvoltage Protection
ACP : Adapter current
sense resistor, positive input.
ADP+ : Adapter Positif Suplay
ADP_ID : Adapter Identity
AGND :Analog Ground
ALWP :ALWAYS ON POWER
B+ : AC OR
BAT POWER RAIL FOR POWER CIRCUIT
BATT : Battery
BAT+ :BAT POWER RAIL FOR POWER CIRCUIT
BAT_DRV :Bat Fet Gate Driver
BAT_V Battery Voltage
BOM :BILL OF MATERIAL MANAGEMENT
BT :BUTTON
BT_EN :Bloototh Enable
BUZER :Connected
BYP :Baypass
CHGEN : Charge enable active-low logic input
CIN
: Input Capacitor
CLK_EN :CLKOCK ENABLE
CN :CONECTOR
CRT :Cathode ray
tube
CSIN :Current Sensor input
Negatif
CSIP :Current Sensor input Positif
DC :Direct
current
DM :DIM/DIM
SOCKET/SOKET MEMORY/SOKET DDR
DOCK :DOCKING SOCKET
EC
:Embedded Controler
EC_ON :Embeded Controler Enable
EMI :Elektromagnetik
Interference(GANGGUAN ELEKTROMAGNETIK)
EN
:ENABLE
ENTRIP :Enable Terminal
F :FUSE
FSEL : Frequency Select
Input.
GATE : Trigger gate
GND :Ground
GP
:GROUND PIN
GPI :General Power
Input
GPIO :General Power
Input Output
HDMI :High-Definition Multimedia
Interface
ID :Continuous Drain Current
IDM :Pulsed Drain Current
IIN : Operating Supply Current
IIN(SHDN): Shutdown Supply Current
IIN(STBY): Standby Supply Current
IS :Continuous Source
Current (Diode Conduction)
IVIN :Battery Supply Current at VIN pin
JP :JUMPER POINT
KBC :Keyboard Controler
LCDV :LCD POWER
LDO :Linear Driver Output
LGATE : Lower-side MOSFET gate signal
LPC :Low Pin Count
LVDS :Low-voltage differential
signaling(SYSTEM PENSIGNALAN)
MBAT :MAIN BATTERY
NB :North
Bridge
ODD :OUTPUT DISC DRIVE
PCI :Peripheral
Component Interconnect
PGOOD : Power good open-drain output
PIR :PRODUCT IMPROVED
RECORD
PSI# :Current indicator
input
PVCC : IC power positive supply
RSMRST : Resume Reset
RTC :REAL TIME CLOCK
SB :
South bridge
SHDN :Shutdown
SYS_SDN :System Shutdown
SPI :Serial
Peripheral Interface
TD :Death Time
THRM :THERMAL SENSOR
TMDS :Transition
Minimized Differential Signaling(TRANSMISI DATA TEKNOLOGY)
TP :TES POINT
TPAD :THERMAL PAD
UVLO : Input Undervoltage Lock Out
V
:RAIL(POWER)
V+ :Positive Voltage
VADJ : Output regulation voltage
VALW :ALWAYS ON POWER
VALWP :VALW PAD
VBAT :BATTERY POWER
VCCP :power chip(ich,graphic chips)
VCORE :POWER PROCESOR
VDD : Control power
supply
VDDR :POWER DDR (VDRAM/VRAM/VMEM)
VDS :VOLTAGE DRAIN SOURCE
VFB : feedback inputs
Power
VGS :VOLTAGE GATE
SOURCES
VIN : Input Voltage
Range
VIN :ADAPTER POWER SUPLAY(vol_in)
VL
:Power Lock
VL
:voltage across the load/Tegangan beban resistor
VL
:Voltage Linear
VLDOIN :Power supply of the VTT and VTTREF output stage (to powerMOS).
VOT :Volt_out
VRAM :Power Memori
VREF :POWER REFERENCES/SCHEMA
REFERENCE/PERMINTAAN SKEMA
VS :SUITCH
POWER
VS+ :SUPPORT VOLTAGE
POSITIF
VSB :POWER SWITCH BUTTON
VSS : Signal ground.
VSW :POWER SWICT
VTT : Memory Termination
Voltage
VTERM :Memory Termination Voltage
VUSB :POWER USB
VGA :POWER VGA
(VGPX/VGPU/VCVOD)
VGFX :POWER GRAPHIC CHIP
VREF :VOLTAGE REFERENCES
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